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29.0 x 37.0 x 11.0 mm
BGA Heat Sink - High Performance
Device Specific - NXP
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29.0 x 37.0 x 11.0 mm BGA Heat Sink - High Performance Device Specific - NXP
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ATS Part#: |
ATS-59006-C1-R0 |
Equivalent PN: |
ATS-59006-C2-R0 Discontinued |
Description: |
29.0 x 37.0 x 11.0 mm BGA Heat Sink - High Performance Device Specific - NXP |
Component Specific: |
N/A |
Heat Sink Type: |
NXP |
Heat Sink Attachment: |
maxiGRIP |
Installation Guide: |
Download PDF |
Thermal Performance: |
See detail |
Mechanical Drawing: |
See detail |
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- Designed for flip-chip processors such as NXP MPCs
- maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB
- Comes preassembled with high performance, phase changing, thermal interface material
Product Details
Part Number |
Length
(mm) |
Width
(mm) |
Height
(mm) |
Fin Tip to Fin Tip
(mm)
|
TIM |
FINISH |
Data Sheet |
RoHS & REACH |
ATS-59006-C1-R0 |
29.0 |
37.0 |
11.0 |
54.0 |
T766 |
BLACK-ANODIZED |
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