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19.0 x 19.0 x 9.5 mm
BGA Heat Sink - High Performance
maxiFLOW/maxiGRIP-Low Profile
*Image above is for illustration purpose only..
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19.0 x 19.0 x 9.5 mm BGA Heat Sink - High Performance maxiFLOW/maxiGRIP-Low Profile
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| ATS Part#: |
ATS-51190D-C1-R0 |
| Equivalent PN: |
ATS-51190D-C2-R0 Discontinued |
| Description: |
19.0 x 19.0 x 9.5 mm BGA Heat Sink - High Performance maxiFLOW/maxiGRIP-Low Profile |
| Component Specific: |
N/A |
| Heat Sink Type: |
maxiFLOW |
| Heat Sink Attachment: |
maxiGRIP |
| Installation Guide: |
Download PDF |
| Thermal Performance: |
See detail |
| Mechanical Drawing: |
See detail |
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- maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling
- maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB
- Meets Telcordia GR-63-Core Office Vibration; ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock and Unpackaged Drop Testing standards
- Comes preassembled with high performance, phase changing, thermal interface material
- Designed for low profile components from 1.5 to 2.99mm
Product Details
| Part Number |
Length
(mm) |
Width
(mm) |
Height
(mm) |
Fin Tip to Fin Tip
(mm)
|
TIM |
FINISH |
Data Sheet |
RoHS & REACH |
|
ATS-51190D-C1-R0 |
19.0 |
19.0 |
9.5 |
31.5 |
T766 |
BLACK- ANODIZED |
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