The Online Publication and Book Series Dedicated to the Thermal Management of Electronics
Qpedia Thermal eMagazine was launched in 2007 as a monthly newsletter focused on the thermal management of
electronics. Now in its 9th year of publication, Qpedia is a highly respected monthly magazine that is distributed
at no charge to over 18,000 engineers. Written and published by the engineers of Advanced Thermal Solutions, Inc.,
Qpedia is a technical resource to help the engineering community solve the most challenging thermal problems. Each
issue provides practical approaches to thermal management challenges and explains the new technologies for
successfully cooling today and tomorrow’s hot-running electronics.
Table of Contents -
September 2010
September 2010
Features
CFD Analysis of a Data Center
Data centers can be considered mission critical facilities, and it is not easy to obtain experimental data for these locations. Thus, much of their planning and optimization is carried out using simulation packages. As with all simulation or numerical results, it is beneficial to have at least one independent result to verify numerical values.
Feasibility Study of an LED-Based Lighting System using Analytical Modeling
In general, LED lighting systems are calculated with no solar load. This is a valid assumption if the lighting systems only operate at night. This article discusses the analytical modeling of an LED-based lighting system for an outdoor application when subjected to various environmental conditions.
Multichip Module Thermal Management
This article discusses three thermal management techniques used to cool an MCM: a thermal conduction module with Direct Solder Attach Cooling (DiSAC), a dual layer thermal interface (TIM) thermal design, and an MCM design with Small Gap Technology (SGT) and a hermetic seal.
Spreading Resistance of Single and Multiple Heat Sources
The prediction of spreading resistance is not as straightforward as using simple equations. Several variables such as heat source and heat sink geometries, number of heat sources, thermal conductivity of heat sink, and convection on heat sink side must be considered to calculate the thermal resistance associated with the geometry change.
Cooling News
New products, services and events from around the industry.
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