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Heat Sinks 17.0 x 17.0 x 9.5 mm BGA Heat Sink - High Performance maxiFLOW/superGRIP-Low-Profile
*Image above is for illustration purpose only..
17.0 x 17.0 x 9.5 mm  BGA Heat Sink - High Performance maxiFLOW/superGRIP-Low-Profile
Heat Sink
Product Details
  • ATS-X51170D-C1-R0
  • 17.0 x 17.0 x 9.5 mm  BGA Heat Sink - High Performance maxiFLOW/superGRIP-Low-Profile
  • maxiFLOW
  • superGRIP
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  • See detail
  • See detail
Product Details
  • Requires minimal space around the component's perimeter; ideal for densely populated PCBs
  • Allows the heat sink to be detached and reattached without damaging the component or the PCB, an important feature in the event a PCB may need to be reworked
  • Strong, uniform attachment force helps achieve maximum performance from phase-change TIMs
  • Eliminates the need to drill mounting holes in the PCB
  • Assembly comes standard with a high performance maxiFLOW™ heat sink, which maximizes convection (air) cooling. Please refer to the superGRIP™  Keep-Out Guidelines and superGRIP™  Installation/Removal Guide for further details
  • Comes standard with clean break, reworkable, Chomerics T-766 phase change material
  • Designed for standard height components, from 1.5 to 2.9 mm
Specifications
Part Number Lifecycle Status Length
(mm)
Width
(mm)
Height
(mm)
Fin Tip to Fin Tip
(mm)
TIM Finish
ATS-X51170D-C1-R0 ACTIVE 17.0 17.0 9.5 28.4 T766 Black Anodized
Thermal Performance
Schematic Image. Air Velocity Thermal Resistance
(ft/min) (m/s) °C/W Unducted Flow °C/W Ducted Flow

*Image above is for illustration purpose only.
A: Length B: Width C: Height D : Fin Tip to Fin Tip.
100 0.5 N/A N/A
200 1.0 18.5 12.6
300 1.5 15.1 N/A
400 2.0 13.1 N/A
500 2.5 11.7 N/A
600 3.0 10.7 N/A
700 3.5 9.9 N/A
800 4.0 9.3 N/A

maxiFLOW superGRIP Low Profile Notes

  • Length and width dimensions refer to the size of the component. Dimensions of the heat sink are subject to tolerances of up to .99 mm in order to accommodate the clip assembly
  • Thermal performance data are provided for reference only. Actual performance may vary by application
  • ATS reserves the right to update or change its products without notice to improve the design or performance
  • Additional tooling fees may be required for custom applications
  • Products generally available and in stock through ATS’s distribution channels. Typical lead time is a minimum of 4-6 weeks
  • Contact ATS to learn about custom options available

ATS-X51170D-C1-R0   (Data Sheet)
17.0 x 17.0 x 9.5 mm  BGA Heat Sink - High Performance maxiFLOW/superGRIP-Low-Profile
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ATS-MaxiGRIP
Shock and Vibe Compliance Data
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superGRIP™
Installation & Removal
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superGRIP™
Clearance Guidelines
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ATS-maxiGRIP
Installation Guidelines
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ATS-maxiGRIP
Clearance Guidelines
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RoHS
Obtain RoHS Certificate
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