Advanced Thermal Solutions -

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Choose the path that matches how much you know about your requirement.

Either path ends with a design summary emailed to you and to ATS engineering at [email protected]. All results are first-order sizing; final performance is confirmed by ATS characterisation.

Quick sizing

Answer these and the engine will figure out the rest.

Device size (X × Y) mm *

Device power W *

Target device case temperature °C *

Ambient / coolant temperature °C *

Preferred cooling method

Application environment

Maximum overall thickness mm — optional

Chamber plus heat sink. Leave at 0 for no limit.

Maximum chamber footprint mm each side — optional

Leave at 0 for no limit.

Anything else worth knowing?

Heat source

The die, module, or contact footprint that touches the vapor chamber evaporator.

Number of sources

Source length X mm *

Source width Y mm *

Source location

Total power W *

Max allowable source temp °C *

Duty cycle %

Steady state is sized at 100%.

Transient peak factor

Peak ÷ steady power.

Source-to-chamber interface

Resulting heat flux W/cm²

Envelope material

Shell alloy sets conductivity, allowable stress, and — critically — fluid compatibility.

Shell material *

Surface finish

Emissivity used for radiation from exposed faces.

Wick material

Mixed metals inside a sealed chamber invite galvanic attack.

Chamber geometry & wick

Overall envelope, internal stack-up, and capillary structure.

Chamber length X mm *

Chamber width Y mm *

Overall thickness Z mm *

Worst-case orientation

Internal stack-up

Wall thickness (each face) mm

Wick structure

Wick thickness mm

Support post pitch mm

Sets bending span of the flat walls.

Support post diameter mm

Vapor core thickness mm

Working fluid & operating window

Fluid choice is constrained by shell compatibility and by the saturation pressure at both ends of your temperature range.

Working fluid *

Charge purity and non-condensable gas control dominate real-world performance; only reagent-grade fluid with a bake-out and evacuation below 10⁻³ mbar should be used.

Minimum operating temp °C

Start-up / cold soak.

Maximum operating temp °C

Vapor temperature ceiling.

Storage min °C

Freeze / thaw check.

Storage or process max °C

Use 250 °C if the chamber passes through solder reflow.

Copper/water is the reference two-phase pair with >20-year proven life. Practical window 25 to 250 °C; freezes at 0 °C. At 70 °C the saturation pressure is 30.8 kPa and the figure of merit is 3.61×10¹¹ W/m². Required purity: reagent grade, <1 ppm ionic, degassed.

Condenser & heat rejection

Where the vapor gives up its latent heat, and what carries it away.

Condenser coverage of chamber face %

Fraction of the opposite face that is actively cooled.

Condenser-to-chamber interface

Heat rejection method *

Coolant / ambient inlet temp °C *

Altitude m

Derates air density.

Design constraints

The engine will not exceed these when it proposes a correction.

Transport safety factor

Required ratio of the governing transport limit to applied power. ATS default 1.5.

Non-condensable gas allowance % of condenser

Blocked condenser area reserved for end-of-life NCG.

Max footprint growth %

Max overall thickness mm

Max chamber mass g

0 = no limit.

Design life years

Shock & vibration

Freeze / thaw cycling required

Notes for the ATS application engineer

Vapor Chamber Design Tool

iVaporChamber™ Design

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How would you like to use the tool?

Quick sizing

Detailed design

Quick sizing

Heat source

Envelope material

Chamber geometry & wick

Working fluid & operating window

Condenser & heat rejection

Design constraints

Design result