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AI Chip Coolers

AI Chip Coolers & Direct Liquid Cooling Cold Plates

 

ATS ArctiQ AI Chip Coolers are direct liquid cooling cold plates designed for high-power GPUs, CPUs, AI processors, and accelerators. Built for AI servers, HPC systems, data centers, edge computing, and industrial electronics, ArctiQ cold plates help engineers manage high heat loads in compact, high-density systems.

NEXA Series

Cold Plates

Compact direct liquid cooling cold plates for AI GPUs, CPUs, and accelerators in high-density server, HPC, and edge AI systems.

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Two industrial cooling distribution modules, one large and black, one small and yellow.

NIVIS Series

Cold Plates

Socket-specific direct liquid cooling cold plates for AMD SP5 processors, supporting high-power AI, HPC, and data center applications.

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NEXA Series Cold Plates

The ArctiQ NEXA Series delivers high-efficiency direct liquid cooling for AI GPUs, accelerators, and processors. NEXA cold plates are compact, precision-machined, and available in aluminum and copper options.

Key features:

  • Liquid cooling for AI GPUs, CPUs, and accelerators
  • Supports up to 9 kW of heat dissipation
  • Compact design for dense server and embedded systems
  • Aluminum and copper cold plate options
  • Ideal for AI servers, HPC, data centers, and edge AI
Learn more
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L=Length (mm);W=Width (mm); H=Height (mm);M=Material;T=Thickness (mm); R=Thermal Resistance (°C/W); dP=Pressure (psi);GPM=Gallons per minute;LPM=Liters per minute;
ATS AI Chip Coolers Family : NEXA Series Cold Plates
ImagePart Number Lifecycle
Status 		Dimension (mm)W (gr) M Flow Rate
1.0 LPM (0.26 GPM)		Flow Rate
2.0 LPM (0.52 GPM)		Flow Rate
3.0 LPM (0.79 GPM)		Flow Rate
4.0 LPM (1.05 GPM)		Flow Rate
5.0 LPM (1.32 GPM)		Flow Rate
6.0 LPM (1.58 GPM)		DatasheetCADRoHSCheck
Stock
L W H R
(°C/W) 		dP
kPA
(psi) 		R
(°C/W) 		dP
kPA
(psi) 		R
(°C/W) 		dP
kPA
(psi) 		R
(°C/W) 		dP
kPA
(psi) 		R
(°C/W) 		dP
kPA
(psi) 		R
(°C/W) 		dP
kPA
(psi) 
ATS-AIC-1012
ATS-AIC-1012 ACTIVE 125 97.5 29.1 327 Al 0.009 0.51
(0.07) 		0.008 1.87
(0.27) 		0.007 4.08
(0.59) 		0.007 7.08
(1.03) 		0.007 10.8
(1.57) 		0.007 15.26
(2.21) 		Check Stock »
ATS-AIC-1013
ATS-AIC-1013 ACTIVE 120 100 29.1 339 Al 0.008 0.49
(0.07) 		0.007 1.78
(0.26) 		0.007 3.82
(0.55) 		0.006 6.55
(0.95) 		0.006 9.87
(1.43) 		0.006 13.89
(2.01) 		Check Stock »
ATS-AIC-1014
ATS-AIC-1014 ACTIVE 95 95.5 29.1 236 Al 0.011 0.51
(0.07) 		0.01 1.89
(0.27) 		0.009 4.1
(0.59) 		0.009 7.05
(1.02) 		0.008 10.78
(1.56) 		0.008 15.4
(2.23) 		Check Stock »
ATS-AIC-1015
ATS-AIC-1015 ACTIVE 99 76.6 29.1 189 Al 0.016 0.51
(0.07) 		0.014 1.81
(0.26) 		0.012 4.01
(0.58) 		0.012 7
(1.02) 		0.011 10.3
(1.49) 		0.01 14.9
(2.16) 		Check Stock »
ATS-AIC-1016
ATS-AIC-1016 ACTIVE 99.17 99 36.02 771 Al / Cu 0.035 2.21
(0.32) 		0.03 9.17
(1.33) 		0.028 20.82
(3.02) 		0.026 36.89
(5.35) 		0.025 57.23
(8.3) 		0.024 81.77
(11.86) 		Check Stock »
ATS-AIC-1017
ATS-AIC-1017 ACTIVE 125 97.5 29.1 1,078 Cu 0.009 3.52
(0.51) 		0.008 12.89
(1.87) 		0.007 28.13
(4.08) 		0.007 48.81
(7.08) 		0.007 74.46
(10.8) 		0.006 105.21
(15.26) 		Check Stock »
ATS-AIC-1018
ATS-AIC-1018 ACTIVE 120 100 29.1 1,119 Cu 0.008 3.38
(0.49) 		0.007 12.27
(1.78) 		0.007 26.34
(3.82) 		0.006 45.16
(6.55) 		0.006 68.05
(9.87) 		0.006 95.77
(13.89) 		Check Stock »
ATS-AIC-1019
ATS-AIC-1019 ACTIVE 95 95.5 29.1 779 Cu 0.011 3.52
(0.51) 		0.01 13.03
(1.89) 		0.009 28.27
(4.1) 		0.009 48.61
(7.05) 		0.008 74.33
(10.78) 		0.007 106.18
(15.4) 		Check Stock »
ATS-AIC-1020
ATS-AIC-1020 ACTIVE 99 76.6 29.1 623 Cu 0.016 3.52
(0.51) 		0.014 12.48
(1.81) 		0.012 27.65
(4.01) 		0.012 48.26
(7) 		0.011 71.02
(10.3) 		0.01 102.73
(14.9) 		Check Stock »
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Server component with copper piping

NIVIS Series Cold Plates

The ArctiQ NIVIS Series provides socket-specific direct liquid cooling for advanced AI and HPC processors, including AMD SP5 applications. NIVIS cold plates are designed for high-power operation in compact system architectures.

Key features:

  • Designed for AMD SP5 processor cooling
  • Supports up to 6.5 kW of heat dissipation
  • Socket-specific design for AI and HPC processors
  • Lightweight, precision-machined aluminum construction
  • CFD-validated for consistent high-power performance
Learn more
L=Length (mm);W=Width (mm); H=Height (mm);M=Material;T=Thickness (mm); R=Thermal Resistance (°C/W); dP=Pressure (psi);GPM=Gallons per minute;LPM=Liters per minute;
ATS AI Chip Coolers Family : NIVIS Series Cold Plates
ImagePart Number Lifecycle
Status 		Dimension (mm)W (gr) M Flow Rate
1.0 LPM (0.26 GPM)		Flow Rate
2.0 LPM (0.52 GPM)		Flow Rate
3.0 LPM (0.79 GPM)		Flow Rate
4.0 LPM (1.05 GPM)		Flow Rate
5.0 LPM (1.32 GPM)		Flow Rate
6.0 LPM (1.58 GPM)		DatasheetCADRoHSCheck
Stock
L W H R
(°C/W) 		dP
kPA
(psi) 		R
(°C/W) 		dP
kPA
(psi) 		R
(°C/W) 		dP
kPA
(psi) 		R
(°C/W) 		dP
kPA
(psi) 		R
(°C/W) 		dP
kPA
(psi) 		R
(°C/W) 		dP
kPA
(psi) 
ATS-AIC-1010
ATS-AIC-1010 ACTIVE 118 92.4 30.85 286 Al 0.024 2.41
(0.35) 		0.015 8.62
(1.25) 		0.011 18.96
(2.75) 		0.009 31.58
(4.58) 		0.008 49.99
(7.25) 		0.007 71.71
(10.4) 		Check Stock »
ATS-AIC-1011
ATS-AIC-1011 ACTIVE 118 92.4 30.85 290 Al 0.02 1.38
(0.2) 		0.012 4.55
(0.66) 		0.009 10.83
(1.57) 		0.007 19.79
(2.87) 		0.006 28.82
(4.18) 		0.006 41.65
(6.04) 		Check Stock »
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Why Direct Liquid Cooling for AI Chips?

AI GPUs, CPUs, and accelerators continue to increase in power density, making air cooling harder to apply in dense servers and HPC systems. Direct liquid cooling cold plates transfer heat from the chip to the coolant loop, helping reduce thermal resistance and support scalable AI system cooling.

  • Supports high heat flux devices
  • Helps manage dense server layouts
  • Reduces chip-to-coolant thermal resistance
  • Supports AI, HPC, and data center cooling
  • Enables scalable liquid cooling system design
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