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Ultra-Cool Active and Passive Solutions for High Powered Devices-

ATS has designed a family of ultra-high-performance active and passive coolers for high-powered processors, such as AI Processors, CPUs, FPGAs, and GPUs. Argus™ and cryoQOOL™ are ultra high peformance, active cooling solutions for the highest performing applications.

dualFLOW™ and quadFLOW™ use a blower to provide additional airflow at the device level. dualFLOW™ pulls air in from two sides, while quadFLOW™ has a unique design that enables air to be pulled across the device from four sides, providing higher thermal performance than other fan-ready heat sinks on the market. These are perfect for systems with constrained airflow.

ATS also has heat sinks that take advantage of system airflow to provide cooling of high-powered devices, available in blue anodized aluminum or nickel-plated copper depending on the thermal and weight restrictions of your project.

The following table details the full family of Ultra-Cool, High-Performance Coolers. Scroll down for more information about the active or passive solutions that ATS has to offer.

Max TDP (W)=Maximum Thermal Design Power (W); R=Thermal Resistance (°C/W);L=Length (mm);W=Width (mm); H=Height (mm); Weight (g);
ATS High-Performance Active and Passive Solutions for High-Powered Device
Dimensions (mm) : QFLOW and DFLOW heat sinks 92.38 (L) X 92.11(W) X 29(H) | Fanless heat sinks 90 L X 90 W X 28 H
Thermal Resistance data are for 40 X 40 mm Component | For QFLOW and DFLOW 100% duty cycle of the blower
ATS-ARGUS-D200 Advanced Thermal Solutions, Inc. 229 0.14 121 121 64 Cu Nickel Plated 970 Designed for cooling dense 2U applications, provides at least 20% improvement over comparable products on the market. Minimum Chassis Height for Cooler is 2U Check Stock »
ATS-UC-CRYQL-100 Advanced Thermal Solutions, Inc. 267 0.12 137 97.6 47.8 Cu None 1610 Designed for cooling dense 2U applications, provides at least 50% improvement over comparable products on the market. Minimum Chassis Height for Cooler is 2U Check Stock »
ATS-UC-DFLOW-100 160 0.20 92.38 92.11 29 Al Nickel Plated 436 For less-resticted PCB layouts,aluminium fins reduce weight and air enters the heat sink from two directions Check Stock »
ATS-UC-DFLOW-200 170 0.19 92.38 92.11 29 Cu Nickel Plated 566 For less-dense PCB layouts, copper fns improve heat spreading and air enters heat sink from two directions. Check Stock »
ATS-UC-DFLOW-VC-200 160 0.20 92.38 92.11 29 Cu Nickel Plated 479 For less-dense PCB layouts, vapor chamber base maximizes heat spreading from small heat sources and air enters from two directions Check Stock »
ATS-UC-NF-100 97 0.33 90 90 28 AL Blue Anodized 190 Ideal for 1U systems with open airflow front to back, aluminium fins reduce weight Check Stock »
ATS-UC-NF-101 105 0.31 90 90 28 AL Blue Anodized 242 Ideal for 1U systems with open airflow front to back, aluminium fins reduce weight Check Stock »
ATS-UC-NF-200 150 0.21 90 90 28 Cu Nickel Plated 728 Ideal for 1U systems with open airflow front to back, aluminium fins reduce weight Check Stock »
ATS-UC-NF-201 190 0.17 90 90 28 Cu Nickel Plated 808 Ideal for 1U systems with open airflow front to back, copper fins reduce spreading resistance Check Stock »
ATS-UC-QFLOW-100 152 0.21 92.38 92.11 29 AL Nickel Plated 456 For PCB layouts with restricted airflow, aluminum fins reduce, weight and air enters the heat sink from four directions Check Stock »
ATS-UC-QFLOW-200 160 0.20 92.38 92.11 29 Cu Nickel Plated 580 For dense PCB layouts, copper fins improve heat spreading and air enters heat sink from four directions Check Stock »
ATS-UC-QFLOW-VC-200 160 0.20 92.38 92.11 29 Cu Nickel Plated 493 For dense PCB layouts, vapor chamber base maximizes heat spreading from small heat sources and air enters from four directions Check Stock »
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