ATS offers a wide variety of ultra-performance extruded heat sinks with high aspect ratio for applications where there is adequate airflow to take optimum advantage from these designs. Heat sink solutions are available for component sizes 10x10mm to 60x60mm. Heat sink height ranges from 2-25mm with 1mm increments. These heat sinks can be attached to the device with double-sided thermal adhesive, Z-clip or
maxiGRIP™ technologies. Custom Pin Fin design offers an excellent cooling solution for spatially constrained PCB layouts when the direction of the airflow in the vicinity of the device is ambiguous.